Micron, Singapore and HBM

Singapore slots itself into the HBM supply chain—key to the AI boom—with a $7 billion Micron investment
It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.
Micron building Singapore chip facility as part of $7B investment
Micron Technology (MU) is building a chip plant in Singapore, as part of an approximately $7 billion investment to meet artificial intelligence (AI) data center demand. The new HBM (high bandwidth memory) advanced packaging facility is a significant step for Singapore amid ongoing efforts to expand AI capacity across the globe.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth.
Singapore strengthens AI edge with Micron’s $7B investment in HBM
Singapore is set to solidify its position in the global semiconductor supply chain with Micron Technology’s announcement of a $7 billion investment in a high-bandwidth memory (HBM) packaging facility.
Micron To Build $7 Billion Advanced Chip Facility In Singapore Amid AI Boom
Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.

Malaysia, Singapore and Special Economic Zone

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