Experienced high-speed PCB design and layout engineering is a major requirement for correctly partitioning a BGA on a PCB. Ideally, this expertise should be inextricably intertwined among chip vendors ...
Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...
Editor's note: This article addresses the need for designers of printed circuit boards for nextgen ICs to be savvy about package-on-package technology. New ways of working with sub-assembly printed ...
This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...
Eagan, MN. Ironwood Electronics has introduced a new high-performance BGA socket for 1-mm pitch, 121-pin BGA ICs. The SG-BGA-6457 socket is designed for 12 x 12-mm package sizes and operates at ...
Recently, we stumbled upon a video by [iBoff], adding an M.2 NVMe port to a 2011-2013 MacBook. Apple laptops never came with proper M.2 ports, especially the A1278 – so what’s up? The trick is – ...
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