IBM to Produce Micron’s Hybrid Memory Cube in Debut of First Commercial, 3D Chip-Making Capability
IBM will present the details of its TSV manufacturing breakthrough at the IEEE International Electron Devices Meeting on December 5 in Washington, DC. HMC parts will be manufactured at IBM's advanced ...
SAN JOSE—Microsoft became the seventh core member of the Hybrid Memory Cube Consortium led by Micron and Samsung, a sign of the broad technical implications for the concept of 3-D memory chip stacks.
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