BEAVERTON, Ore.--(BUSINESS WIRE)--Today the Universal Chiplet Interconnect Express™ (UCIe™) Consortium announced the release of its 2.0 Specification. The UCIe 2.0 Specification adds support for a ...
Mirabilis Design offers full support for System-level UCIe IP & architecture exploration platform for early Chiplet package design for a range of applications SANTA CLARA, CALIFORNIA, UNITED STATES, ...
RIYADH, Saudi Arabia, Sept. 22, 2025 /PRNewswire/ -- Alfaisal University has announced the acquisition of a cutting-edge 3D construction printer from Australian company LUYTEN 3D. The new technology ...
Apprenez à créer votre toute première pièce pour l’impression 3D grâce à ce tutoriel détaillé et facile à suivre. Idéal pour débutants et passionnés de fabrication numérique ! #impression3D #tutoriel ...
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