Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at straitstimes.com.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM advanced packaging facility,

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Artificial intelligence technology has been a major driver of the bull market over the past couple of years. Technology firms, especially the

The main piece of news driving Micron stock higher was that Nvidia will be using Micron's high-bandwidth-memory (HBM) in its new GeForce RTX 50 Blackwell GPUs that undergird its new advanced AI platform.

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High Bandwidth Memory (HBM) revenue doubled sequentially, with a TAM projection growing from $16B in CY24 to $30B in CY25. Q1-FY25 DRAM revenue reached $6.4B (73% of total), increasing 87% YoY and 20% sequentially.

Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.