SEMICON Japan, Booth E5345 - Rapidus Corporation today announced a new suite of AI design tools to support its Rapidus AI-Assisted Design Solution (Raads), a key initiative to helping to realize its ...

The initiative forms part of the company’s broader strategy to realise its Rapid and Unified Manufacturing Service (RUMS) concept. The technology platform, previously known as Rapidus AI-Assisted ...

The CEO and CEO-elect of Imec have talked about their priorities and strategies for 2026. “The pace at which AI has permeated ...

While batteries represent the most visible opportunity of the increasing electrification trend, semiconductors are also opening up a parallel opportunity.

Welcome to Electronic Design's coverage of the 2026 Consumer Electronics Show. This year's show looks to be heavy on artificial intelligence (AI) again, but there's a lot more. Our editors will add to ...

Cadence today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, ...

Using TI's 10BASE-T1S Ethernet PHY, automakers can extend Ethernet to vehicle edge nodes with reduced wiring complexity and ...

Telephone and television reception, GPS navigation systems, broadband internet via satellite – none of this would be possible ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

On December 17, Rapidus announced a new suite of AI-based semiconductor design tools under its Rapidus AI-Assisted Design Solution (Raads), aimed at supporting the company's Rapid and Unified ...

The chiplet-based approach allows Intel to mix-and-match these tiles to offer three distinct iterations of Panther Lake: the ...