Typical reticle usage Chip manufacturing costs are heavily dependent on throughput in the fab, which typically is measured by the number of wafers that can be processed per hour. Assuming yield is ...

Today, there are still many ways for defects to slip through final testing and get shipped to customers. However, in-line macro defect inspection and guardbanding are important and powerful tools that ...

Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising?

After nearly three decades, the era of copper interconnects may be coming to an end. Sort of. At interconnect CDs below 10nm, ...

A major challenge in 3D NAND design and manufacturing is tier bending and tier collapse (Figure 1b). Tier collapse of the oxide cantilever can be caused by a combination of factors: intrinsic stress ...