Ever wondered what life was really like thousands of years ago? Thanks to the treasures unearthed by archaeologists, we get ...
Abstract: The development of 5G era has set higher standards for existing radio frequency (RF) packaging technologies, driving wafer-level packaging (WLP) toward small size, enhanced performance, and ...
Abstract: To preserve the bonding surface quality, this paper proposes and demonstrates the feasibility of incorporating an inorganic protective layer in the direct die-to-wafer (D2W) hybrid bonding ...
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