You never know where change will lead you. What started out as an attempt to fine-tune my existing HO scale layout ended with a new house and a 2,600 square-foot, four-deck model railroad – the Sunset ...
Abstract: A robust physical design of 3-D IC requires investigation on through-silicon via (TSV). The large temperatures and stress gradients can severely affect TSV delay with large variation. The ...
This is quick tutorial to using Blender to model 3D low poly tree. Tutorial for step by step for beginner. Timestamp 00:00 ...